Title :
Problem solving techniques in electronic cooling
Author_Institution :
AT&T Bell Lab., Ward Hill, MA, USA
Abstract :
The goal of this study is to provide a general approach to the solution of problems confronted in the cooling of electronic systems. A review is presented of the theoretical tools necessary for the solution of thermal (heat transfer and fluid flow) problems and their utility. A general approach to problem-solving is outlined. In addition, a procedural approach to problems encountered in electronic cooling is provided.<>
Keywords :
cooling; heat sinks; heat transfer; packaging; electronic cooling; fluid flow; heat transfer; Differential equations; Electronics cooling; Fluid flow; Fluid flow control; Heat transfer; Integral equations; Problem-solving; Steady-state; System performance; Temperature;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1989. SEMI-THERM V., Fifth Annual IEEE
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/STHERM.1989.76063
