• DocumentCode
    2750023
  • Title

    Conceptualizing an Optimal Electronic Product Design and End-of-Life Management System

  • Author

    Rifer, Wayne ; Katz, John ; Omelchuck, Jeff ; Salazar, Viccy

  • Author_Institution
    EPEAT Operations Manager, Portland
  • fYear
    2007
  • fDate
    7-10 May 2007
  • Firstpage
    159
  • Lastpage
    163
  • Abstract
    The current paper identifies the importance of electronic product reuse, dismantling and component recovery for an environmentally preferable end-of life management system. The optimal system would integrate product design and end- of-life management. The paper identified how European eco-label systems reinforced these important elements through design requirements that support deep disassembly. However, recycling systems have migrated to automated processing that does not take advantage of the design for disassembly features. The Electronic Product Environmental Assessment Tool (EPEAT) adopted criteria that support both shredding and deep disassembly. The paper concludes by noting that in the U.S. the recycling infrastructure is still largely dependant for its economic sustainability on reuse and component recovery, which does rely on the ability to efficiently disassemble products.
  • Keywords
    design for disassembly; electronic products; electronics industry; product design; product life cycle management; recycling; waste recovery; automated processing; component recovery; disassembly features; dismantling; eco-label systems; electronic product design; electronic product environmental assessment tool; electronic product reuse; end-of-life management system; optimal system; Consumer electronics; Councils; Environmental management; Guidelines; Product design; Protection; Recycling; Region 10; Region 9; Signal design; EPEAT; design for recycling; eco labels;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics & the Environment, Proceedings of the 2007 IEEE International Symposium on
  • Conference_Location
    Orlando, FL
  • ISSN
    1095-2020
  • Print_ISBN
    1-4244-0861-X
  • Type

    conf

  • DOI
    10.1109/ISEE.2007.369386
  • Filename
    4222875