3-D wafer-scale interconnect and packaging using photosensitive glass-ceramic substrates

Author

Jacobi, William J. ; Reche, John J H

Author_Institution

Space Comput. Corp., Santa Monica, CA, USA

fYear

1989

fDate

22-26 May 1989

Firstpage

4

Abstract

The authors describe a form of HWSI (hybrid wafer-scale integration) that uses high-precision, photomachined glass-ceramic substrates combined with high-thermal-conductivity materials in composite packaging structures. Features include thermal management, recessed die cavities, short-lead IC connections, functional IC pretesting, and 3-D substrate stacking. The development program includes the fabrication of test vehicles for electrical and thermal characterization, for evaluation of alternative packaging approaches, and for environment testing

Keywords

ceramics; environmental testing; glass; heat sinks; integrated circuit technology; integrated circuit testing; packaging; substrates; 3-D substrate stacking; composite structures; environment testing; functional IC pretesting; high-thermal-conductivity materials; hybrid wafer-scale integration; packaging; photosensitive glass-ceramic substrates; recessed die cavities; short-lead IC connections; thermal management; wafer-scale interconnect; Fabrication; Integrated circuit interconnections; Integrated circuit packaging; Nonhomogeneous media; Silicon; Substrates; Testing; Thermal conductivity; Thermal management; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace and Electronics Conference, 1989. NAECON 1989., Proceedings of the IEEE 1989 National

Conference_Location

Dayton, OH

Type

conf

DOI

10.1109/NAECON.1989.40183

Filename

40183