DocumentCode :
2751617
Title :
Capacitive and inductive couplings of PCB traces
Author :
Yan, Tang Tung ; Jenu, Mohd Zarar Mohd
Author_Institution :
Dept. of Electr. Eng., Inst. Teknologi Tun Hussein Onn, Batu Pahat, Malaysia
Volume :
1
fYear :
2000
fDate :
2000
Firstpage :
186
Abstract :
In an electrical and electronic system, performance degradation may occur due to crosstalk. This paper outlines the modeling and analysis of crosstalk pertaining to PCB traces: reactive and radiated. Each crosstalk needs different modeling technique due to their different nature. From the model, parameters that contribute to the crosstalk can be identified. Plots of crosstalk response due to variation in separation distance of the traces, height of traces from ground plane, and source-load impedance are displayed and discussed. Special needs to overcome near-field coupling such as shielding are highlighted. There is resonance in the response of the crosstalk at high frequencies (□/λ≫1, where □ is the length of a trace and λ is the signal wavelength) due to near-field radiation coupling. This paper identifies the critical parameters that dampen the resonance. The results shown in this paper can be used by circuit designers to reduce the effect of crosstalk especially at high frequency
Keywords :
capacitance; crosstalk; electric impedance; electromagnetic coupling; electromagnetic induction; electromagnetic shielding; printed circuits; resonance; transmission line theory; HF; PCB traces; capacitive coupling; dipole model; electrical system; electronic system; ground plane; height; high frequencies; inductive coupling; near-field coupling; performance degradation; radiated crosstalk; reactive crosstalk; resonance; separation distance; shielding; signal wavelength; source-load impedance; transmission line model; Coupling circuits; Crosstalk; Degradation; Frequency; Impedance; Mathematical model; Near-field radiation pattern; Resonance; Tellurium; Transmission line theory;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
TENCON 2000. Proceedings
Conference_Location :
Kuala Lumpur
Print_ISBN :
0-7803-6355-8
Type :
conf
DOI :
10.1109/TENCON.2000.893567
Filename :
893567
Link To Document :
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