Title :
The reusable protocol-common block that can simulate the hardware characteristics
Author :
Moon, T.Y. ; Seo, S.H. ; Kim, S.H. ; Kim, J.H. ; Kwon, K.H. ; Jeon, J.W. ; Hwang, S.H.
Author_Institution :
Sch. of Inf. & Commun. Eng., Sungkyunkwan Univ., Suwon
Abstract :
Nowadays, electronic control units (ECUs) have more and more importance on the value of modern automobiles. This trend is causing the complexity of the overall systems to increase and make the development cycles longer. In order to address these problems, strategies to reuse software and a growing emphasis to develop hardware/software co-simulation schemes are gathering strength. The software reuse allows modular design aspects to be promoted and helps in limiting the development efforts needed. The hardware/software co-simulation enables early validation, easy robustness evaluation of the system and reduces the overall development cycles. This article proposes the development and adoption of software reusable blocks that can be in the hardware and/or software domains. The proposed blocks contain the common characteristics of several communication protocols. In this paper, we develop the CAN communication protocol by using the proposed softwarepsilas reusable common blocks and added block that has some protocol specialized characteristics and compare the simulation results with real CAN signals from 16-bit embedded system for ECUs.
Keywords :
automobiles; automotive electronics; control engineering computing; controller area networks; hardware-software codesign; protocols; CAN signals; ECU; electronic control units; embedded system; hardware characteristics; hardware-software cosimulation schemes; modular design aspects; reusable protocol-common block; robustness evaluation; software reusable blocks; Automobiles; Automotive engineering; Communication networks; Communication system control; Embedded system; Hardware; Mathematical model; Protocols; Software reusability; Working environment noise;
Conference_Titel :
Industrial Informatics, 2008. INDIN 2008. 6th IEEE International Conference on
Conference_Location :
Daejeon
Print_ISBN :
978-1-4244-2170-1
Electronic_ISBN :
1935-4576
DOI :
10.1109/INDIN.2008.4618283