• DocumentCode
    2751779
  • Title

    Experimental study of stress and thermoelastic effects in planar stress-compensated SAW quartz cuts

  • Author

    Ballandras, S. ; Bigler, E.

  • Author_Institution
    Lab. de Phys. et Metrol. des Oscillateurs du CNRS, Besancon, France
  • fYear
    1990
  • fDate
    4-7 Dec 1990
  • Firstpage
    465
  • Abstract
    Two experimental tests are reported. The first are mechanical tests at constant temperature, involving two- or four-point diametral compression of a circular quartz substrate supporting a SAW (surface acoustic wave) delay line used in an oscillator. The second test involves investigation of dynamical temperature effects. The same circular delay line is subjected to temperature cycles, the external heat flux coming through two-point diametral fixations. Frequency-temperature cycles are measured and used to characterize the sensitivity of the device to dynamical thermal effects. The experimental results indicate that SAW devices present intrinsic compensation to mechanical and thermal perturbation
  • Keywords
    mechanical testing; quartz; surface acoustic wave devices; thermal stresses; thermoelasticity; ultrasonic delay lines; SAW delay line; SiO2; circular quartz substrate; dynamical temperature effects; four-point diametral compression; intrinsic compensation; mechanical tests; planar stress-compensated SAW quartz cuts; temperature cycles; thermoelastic effects; two-point diametral compression; Acoustic testing; Acoustic waves; Delay lines; Frequency; Oscillators; Surface acoustic wave devices; Surface acoustic waves; Temperature sensors; Thermal stresses; Thermoelasticity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1990. Proceedings., IEEE 1990
  • Conference_Location
    Honolulu, HI
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1990.171409
  • Filename
    171409