DocumentCode
2751779
Title
Experimental study of stress and thermoelastic effects in planar stress-compensated SAW quartz cuts
Author
Ballandras, S. ; Bigler, E.
Author_Institution
Lab. de Phys. et Metrol. des Oscillateurs du CNRS, Besancon, France
fYear
1990
fDate
4-7 Dec 1990
Firstpage
465
Abstract
Two experimental tests are reported. The first are mechanical tests at constant temperature, involving two- or four-point diametral compression of a circular quartz substrate supporting a SAW (surface acoustic wave) delay line used in an oscillator. The second test involves investigation of dynamical temperature effects. The same circular delay line is subjected to temperature cycles, the external heat flux coming through two-point diametral fixations. Frequency-temperature cycles are measured and used to characterize the sensitivity of the device to dynamical thermal effects. The experimental results indicate that SAW devices present intrinsic compensation to mechanical and thermal perturbation
Keywords
mechanical testing; quartz; surface acoustic wave devices; thermal stresses; thermoelasticity; ultrasonic delay lines; SAW delay line; SiO2; circular quartz substrate; dynamical temperature effects; four-point diametral compression; intrinsic compensation; mechanical tests; planar stress-compensated SAW quartz cuts; temperature cycles; thermoelastic effects; two-point diametral compression; Acoustic testing; Acoustic waves; Delay lines; Frequency; Oscillators; Surface acoustic wave devices; Surface acoustic waves; Temperature sensors; Thermal stresses; Thermoelasticity;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1990. Proceedings., IEEE 1990
Conference_Location
Honolulu, HI
Type
conf
DOI
10.1109/ULTSYM.1990.171409
Filename
171409
Link To Document