Title :
Chip-package co-design for mixed SoC
Author :
Gao, YuHan ; Liu, Lintao ; Chen, Liang ; Li, Ruzhang ; Xu, Ruimin
Author_Institution :
Nat. Lab. of Analog IC´´s, Chongqing, China
fDate :
July 28 2010-Aug. 1 2010
Abstract :
A chip-package co-design method is presented for high frequency mixed SoC. Based on the analysis of simulation result of package and chip, a RC circuit which is composed of resistor and capacitor is designed on chip to suppress the affect of Simultaneous Switch Noise(SSN). Consequently, chip-package co-simulation achieves a good agreement with measurement as the co-design method is used to predict the performance of mixed SoC.
Keywords :
integrated circuit design; mixed analogue-digital integrated circuits; system-on-chip; RC circuit; chip-package co-design; mixed SoC; simultaneous switch noise; system-on-chip; Equivalent circuits; Integrated circuit modeling; Noise; Semiconductor device measurement; Simulation; System-on-a-chip; Wire; RC circuit; SSN; SoC; chip-package; co-design;
Conference_Titel :
Laser Physics and Laser Technologies (RCSLPLT) and 2010 Academic Symposium on Optoelectronics Technology (ASOT), 2010 10th Russian-Chinese Symposium on
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-5511-9
DOI :
10.1109/RCSLPLT.2010.5615311
