• DocumentCode
    2752375
  • Title

    A preconditioned waveform relaxation solver for Signal Integrity analysis of high-speed channels

  • Author

    Hu, H. ; Grivet-Talocia, S.

  • Author_Institution
    Dip. Elettron. e Telecomun., Politec. di Torino, Turin, Italy
  • fYear
    2012
  • fDate
    17-21 Sept. 2012
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This work presents a fast transient solver for Signal Integrity analysis of high-speed channels. We consider general chip-to-chip coupled interconnect structures, including arbitrary discontinuities at chip, package and board level. An external characterization of the interconnect in terms of tabulated scattering frequency samples is first converted to a closed-form macromodel, whose transient effects on input signals can be computed very efficiently through recursive convolutions. When combined with suitable models for drivers and receivers, a large-scale but very sparse system of equations is obtained. The latter is solved by an iterative scheme based on the Generalized Minimal RESidual (GMRES) method, further enhanced by a preconditioner based on Waveform-Relaxation. Contrary to previous formulations, the proposed scheme is guaranteed to converge in few iterations. Numerical examples show that the proposed solver outperforms standard SPICE in terms of runtime, with no loss of accuracy.
  • Keywords
    electromagnetic wave scattering; iterative methods; GMRES method; SPICE; chip-to-chip coupled interconnect structure; closed-form macromodel; generalized minimal residual; high-speed channel; iterative scheme; preconditioned waveform relaxation solver; signal Integrity analysis; tabulated scattering frequency; transient solver; Convergence; Equations; Frequency domain analysis; Mathematical model; Scattering; Transient analysis; Vectors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC EUROPE), 2012 International Symposium on
  • Conference_Location
    Rome
  • ISSN
    2325-0356
  • Print_ISBN
    978-1-4673-0718-5
  • Type

    conf

  • DOI
    10.1109/EMCEurope.2012.6396870
  • Filename
    6396870