DocumentCode :
2752494
Title :
Voltage sags improvement for the high-tech industrial customers by using cogeneration system
Author :
Hsu, Cheng-Ting
Author_Institution :
Southern Taiwan Univ., Tainan
fYear :
2007
fDate :
Oct. 30 2007-Nov. 2 2007
Firstpage :
1
Lastpage :
4
Abstract :
This paper presents the improvement of the voltage sags for the semiconductor fabrication facility by the installation of cogeneration systems. The critical equipment is evaluated against the SEMI F47 and ITIC power quality documents. The cogeneration system is installed to mitigate the voltage sags due to external system faults. Also, the under voltage relays to disconnect the cogeneration system from the utility are designed by considering the critical clearing times at the point of common coupling and voltage sags ride-through curves. The dynamic responses of different fault conditions are executed by using the transient stability analysis to calculate and define the voltage sags ride-through curves with and without considering the disconnection of the cogeneration system. It is concluded that the voltage sags ride-through capability can be improved greatly if the cogeneration systems are performed to trip accurately according to the under voltage relays design proposed by the paper.
Keywords :
cogeneration; electronics industry; power supply quality; power system transient stability; production facilities; semiconductor device manufacture; ITIC power quality documents; SEMI F47; cogeneration system; dynamic responses; fault conditions; ride-through curves; semiconductor fabrication facility; system faults; transient stability analysis; under voltage relays; voltage sags improvement; Cogeneration; Electrical equipment industry; Fabrication; Manufacturing industries; Power generation; Power quality; Power system stability; Standby generators; Textile industry; Voltage fluctuations; Cogeneration; Semiconductor Fabrication Plant; Voltage Sag;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
TENCON 2007 - 2007 IEEE Region 10 Conference
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-1272-3
Electronic_ISBN :
978-1-4244-1272-3
Type :
conf
DOI :
10.1109/TENCON.2007.4428914
Filename :
4428914
Link To Document :
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