• DocumentCode
    2752557
  • Title

    A novel flat micro heat pipe with fiber wick

  • Author

    Xiaowei, Liu ; Tian, Han ; Tian, Dong ; Chao, Wang

  • Author_Institution
    MEMS Center, Harbin Inst. of Technol., Harbin, China
  • fYear
    2010
  • fDate
    July 28 2010-Aug. 1 2010
  • Firstpage
    307
  • Lastpage
    310
  • Abstract
    A novel flat micro heat pipe with glass fiber wick structure is introduced in this paper. The structure of the wick is presented and also the excellence of the structure is described. For the novel flat micro heat pipe, a mathematical model is founded and the maximum heat transports is calculated which is 2.3 w. Experimental testing is performed for the fabricated micro heat pipe in vacuum. The testing maximum heat transport is about 2 w, and the testing results are also compared with grooved micro heat pipe.
  • Keywords
    glass fibres; heat pipes; heat transfer; integrated circuit packaging; flat micro heat pipe; glass fiber wick; grooved micro heat pipe; integrated circuit packaging; maximum heat transport; Copper; Glass; Heat transfer; Heating; Mathematical model; Optical fiber devices; Testing; fiber; maximum heat transfer; micro heat pipe; wick;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Laser Physics and Laser Technologies (RCSLPLT) and 2010 Academic Symposium on Optoelectronics Technology (ASOT), 2010 10th Russian-Chinese Symposium on
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-5511-9
  • Type

    conf

  • DOI
    10.1109/RCSLPLT.2010.5615341
  • Filename
    5615341