• DocumentCode
    2753014
  • Title

    300 A delta VF tester

  • Author

    Pshaenich, Al

  • Author_Institution
    Motorola Inc., Phoenix, AZ, USA
  • fYear
    1989
  • fDate
    7-9 Feb. 1989
  • Firstpage
    140
  • Lastpage
    145
  • Abstract
    A description is given of the design and development of a relatively low-cost, high-current, transient-thermal-resistance tester. Using delta techniques, the tester was initially used to measure the die bond integrity of large power-handling rectifier assemblies, but because of its versatility it can thermally characterize most semiconductor junctions. Circuit design details and testing of several products are illustrated, including V/sub F/ (forward voltage) and Delta V/sub V/ measurements of power rectifiers and smart power ICs.<>
  • Keywords
    electronic equipment testing; integrated circuit testing; power integrated circuits; rectifiers; test equipment; thermal resistance measurement; transients; 300 A; delta techniques; die bond integrity; forward voltage; power rectifiers; rectifier assemblies; semiconductor junctions; smart power ICs; transient-thermal-resistance tester; Bonding; Circuit testing; Electrical resistance measurement; Heating; MOSFETs; Power measurement; Rectifiers; Semiconductor diodes; Thermal resistance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal and Temperature Measurement Symposium, 1989. SEMI-THERM V., Fifth Annual IEEE
  • Conference_Location
    San Diego, CA, USA
  • Type

    conf

  • DOI
    10.1109/STHERM.1989.76080
  • Filename
    76080
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2753014