Title :
Laser-chemical three-dimensonal writing of multimaterial structures for microelectromechanics
Author :
Bloomstein, T.M. ; Ehrlich, D.J.
Author_Institution :
Lincoln Lab., MIT, Lexington, MA, USA
fDate :
30 Jan-2 Feb 1991
Abstract :
A patterning machine capable of 5×104 pixel per second random access scanning has been developed as a tool for laser microchemical fabrication of three-dimensional parts. The tool is designed to implement precision laser deposition and etching reactions through a direct interface to solid modeling CAD/CAM (computer-aided design/manufacturing) software. Initial results with the three-dimensional laser patterning machine demonstrate clean etching of germanium and silicon with micrometer depth control and speeds one to two orders of magnitude faster than electric discharge machining. High material selectivity has been exploited to write buried flow channels under oxide membranes
Keywords :
etching; germanium; laser beam machining; micromechanical devices; silicon; Ge etching; Si etching; clean etching; high-speed etching; laser chemical 3D writing; laser microchemical fabrication; material selectivity; microelectromechanics; micrometer depth control; multimaterial structures; patterning machine; precision laser deposition; precision laser etching; random access scanning; solid modeling CAD/CAM; three-dimensional laser patterning machine; write buried flow channels under oxide membranes; CADCAM; Computer aided manufacturing; Design automation; Etching; Laser modes; Optical design; Optical device fabrication; Solid lasers; Solid modeling; Writing;
Conference_Titel :
Micro Electro Mechanical Systems, 1991, MEMS '91, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots. IEEE
Conference_Location :
Nara
Print_ISBN :
0-87942-641-1
DOI :
10.1109/MEMSYS.1991.114796
