Title :
Surface-machined micromechanical membrane pump
Author :
Judy, Jack W. ; Tamagawa, Takashi ; Polla, Dennis L.
Author_Institution :
Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
fDate :
30 Jan-2 Feb 1991
Abstract :
An electrostatic micromechanical membrane pump for fluids and gases has been designed and fabricated with a process that is compatible with integrated circuits. The process consists of six photolithography steps and eight low-pressure chemical vapor depositions. No bulk silicon etchants or wafer bonding techniques are used. Each pump consists of an input valve, a pumping membrane, and an output valve. All parts are encapsulated by silicon nitride and are actuated by electrostatic forces. Actuation voltages of approximately 50 V are required for observable valve closure and membrane deflections. Typical gas pumping displacements are between 12 to 640 nL per cycle
Keywords :
micromechanical devices; pumps; 50 V; IC compatible process; Si3N4 encapsulation; actuation voltages; electrostatic micromechanical membrane pump; fluid pumping; gas pumping displacements; input valve; low-pressure chemical vapor depositions; output valve; photolithography steps; pumping membrane; surface machined micropump; Biomembranes; Chemical vapor deposition; Electrostatics; Etching; Gases; Lithography; Micromechanical devices; Pumps; Silicon; Valves;
Conference_Titel :
Micro Electro Mechanical Systems, 1991, MEMS '91, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots. IEEE
Conference_Location :
Nara
Print_ISBN :
0-87942-641-1
DOI :
10.1109/MEMSYS.1991.114792