Title :
Real time in-situ monitoring and characterization of production wafer probing process
Author :
Quach, Minh ; Harper, Kim
Author_Institution :
Hewlett Packard Integrated Circuit Bus. Div., Corvallis, OR, USA
Abstract :
This paper introduces a new technique that enables real-time monitoring and characterization of a production wafer probing process. Using this new technique, probing contact resistance data taken from production wafers has been correlated with wafer yield. Data are presented showing that production wafers are better suited for characterizing probing contact resistance than metalized setup wafers
Keywords :
computerised monitoring; contact resistance; electric resistance measurement; integrated circuit testing; production testing; real-time systems; Delta V technique; contact resistance data; metalized setup wafers; probing; production wafer probing; real time in-situ monitoring; Circuit testing; Cleaning; Contact resistance; Debugging; Fabrication; Monitoring; Personnel; Probes; Production; Voltage;
Conference_Titel :
Test Conference, 1997. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-4209-7
DOI :
10.1109/TEST.1997.639694
