Title :
Thermal diagnostics of semiconductor devices
Author :
Nowakowski, Antoni Z.
Author_Institution :
Inst. of Electron. Technol., Tech. Univ. of Gdansk, Poland
Abstract :
The ideal of complex investigation of the thermal performance of semiconductor devices is presented. Production diagnostics using thermal characteristics for the determination of packaging faults are discussed. The system under development is described. The system allows measurements of a device under test (DUT) in following modes: an individual test, which gives its thermal characteristics obtained from indirect electrical measurements; a train of tests for its safe operation area (SOA) boundary determination; and a diagnostics procedure which indicates the occurrence of a fault, its location, and probable reason for its occurrence during semiconductor device manufacture.<>
Keywords :
characteristics measurement; fault location; packaging; production testing; semiconductor device testing; thermal variables measurement; boundary; diagnostics; packaging faults; production testing; safe operation area; semiconductor device manufacture; semiconductor device testing; thermal characteristics; Area measurement; Electric variables measurement; Production; Semiconductor device manufacture; Semiconductor device measurement; Semiconductor device packaging; Semiconductor device testing; Semiconductor devices; Semiconductor optical amplifiers; System testing;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1989. SEMI-THERM V., Fifth Annual IEEE
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/STHERM.1989.76084
