DocumentCode
2753866
Title
Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (IEEE Cat. No.89CH2688-0)
fYear
1989
fDate
7-9 Feb. 1989
Abstract
Presents the cover from the proceedings of this conference.
Keywords
VLSI; cooling; heat transfer; infrared imaging; packaging; printed circuits; semiconductor technology; surface mount technology; temperature measurement; thermal analysis; IR surface-temperature measurements; MOS integrated circuits; VF tester; VLSI plastic package; buried resistors; calibration; chip packages; cooling; electronic cooling; encapsulation; finite-element models; flow; four-layer infinite plate structure; hybrid integrated circuits; integration algorithm; microwave bipolar devices; mixing; packaging; periodically pulsed fluid; rectangular cavities; semiconductor devices; surface mount plastic packages; thermal analysis; thermal characteristics; thermal diagnostics; thermal impedance; thermal modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal and Temperature Measurement Symposium, 1989. SEMI-THERM V., Fifth Annual IEEE
Conference_Location
San Diego, CA, USA
Type
conf
DOI
10.1109/STHERM.1989.76085
Filename
76085
Link To Document