DocumentCode
2753911
Title
A Non-Intrusive and Accurate Inspection Method for Segment Delay Variabilities
Author
Chen, Ying-Yen ; Liou, Jing-Jia
Author_Institution
Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear
2009
fDate
23-26 Nov. 2009
Firstpage
343
Lastpage
348
Abstract
Diagnosis for delay defects becomes more significant as the CMOS process advances to nanometer regime. The most challenging problems of delay fault diagnosis in nanometer process come from the process variation, which results in small delay variations. Small delay variations are difficult to be diagnosed by using existing methods based on a specific fault model. This paper presents a new estimation method for gate or interconnect delays based on the maximum likelihood estimation. The proposed method outputs most probable gate/interconnect delays that matches the measured path delays under the nominal delay distribution. Unlike the previous diagnosis methods, our method does not take any assumption on defect numbers, sizes and types (models), and thus it can be used to diagnose performance bottlenecks resulted from systematic variations. The experimental results show that the average correlation achieves 0.848 between estimated (by the proposed method) and sampled segment delays (generated from process models) for ISCAS89 benchmarks. There is a substantial improvement of 0.271 over the existing method.
Keywords
CMOS logic circuits; delays; fault diagnosis; inspection; integrated circuit interconnections; integrated circuit testing; maximum likelihood estimation; CMOS process; accurate inspection method; gate delays; interconnect delays; logic circuits; maximum likelihood estimation; nominal delay distribution; nonintrusive inspection method; path delays; process models; segment delay variabilities; CMOS process; Circuit faults; Circuit testing; Data mining; Delay estimation; Inspection; Integrated circuit interconnections; Monitoring; Support vector machines; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
Asian Test Symposium, 2009. ATS '09.
Conference_Location
Taichung
ISSN
1081-7735
Print_ISBN
978-0-7695-3864-8
Type
conf
DOI
10.1109/ATS.2009.32
Filename
5359315
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