DocumentCode :
2753962
Title :
Development of a MEMS testing methodology
Author :
Kolpekwar, Abhijeet ; Blanton, R. D Shawn
Author_Institution :
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
fYear :
1997
fDate :
1-6 Nov 1997
Firstpage :
923
Lastpage :
931
Abstract :
Microelectromechanical systems (MEMS) are miniature electromechanical sensor and actuator systems developed from the mature batch-fabricated processes of VLSI technologies. Projected growth in the MEMS market requires significant advances in CAD and manufacturing for MEMS. These advances must be accompanied with testing methodologies that ensure both high quality and reliability. We describe our approach for developing a comprehensive testing methodology for a class of MEMS known as surface micromachined sensors. Our first step involving manufacturing process and low-level mechanical simulations is illustrated by studying the effects of realistic contaminations on the folded-flexure comb-drive resonator. The simulation results obtained indicate that realistic contaminations can create a variety of defective structures that result in a wide spectrum of faulty behaviors
Keywords :
micromachining; micromechanical devices; quality control; semiconductor device reliability; semiconductor device testing; MEMS testing methodology; batch-fabricated processes; defective structures; electromechanical actuator; electromechanical sensor; faulty behavior; folded-flexure comb-drive resonator; low-level mechanical simulations; microelectromechanical systems; quality; reliability; surface micromachined sensors; Actuators; Computer aided manufacturing; Electromechanical sensors; Mechanical sensors; Microelectromechanical systems; Micromechanical devices; Sensor phenomena and characterization; Surface contamination; Testing; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 1997. Proceedings., International
Conference_Location :
Washington, DC
ISSN :
1089-3539
Print_ISBN :
0-7803-4209-7
Type :
conf
DOI :
10.1109/TEST.1997.639707
Filename :
639707
Link To Document :
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