DocumentCode :
2754167
Title :
Low-power RF-ICs in wireless transceivers
Author :
Abidi, A.A.
Author_Institution :
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
fYear :
1994
fDate :
10-12 Oct. 1994
Firstpage :
18
Lastpage :
21
Abstract :
This paper presents a brief survey of the highlights in the application of IC technology to radios since the 1970s, and follows this with trends of what the author considers is the shape of things to come in wireless transceivers over the next few years. RF-ICs are roughly defined as integrated circuits operating in the band of frequencies from 100 MHz to 2000 MHz which covers most consumer wireless devices. MMICs, by contrast, are small-scale ICs operating at tens of GHz which are almost exclusively fabricated on III-V compound semiconductor substrates. Driven by defence applications over the past decade, they have become an established discipline. RF-ICs are principally driven by consumer needs. They are, and will continue to be, fabricated mostly in mature silicon technologies, combining analog and digital functions at relatively large levels of integration. It is the authors belief that in response to pressing demands for ubiquitous wireless access, the day of the "VLSI radio" is not that far off.
Keywords :
UHF integrated circuits; 100 to 2000 MHz; RF IC design; Si; Si technologies; integrated circuits; large-scale integration; low-power RF ICs; power-reduction strategies; wireless transceivers; Application specific integrated circuits; Frequency; III-V semiconductor materials; Integrated circuit technology; MMICs; Pressing; Shape; Silicon; Substrates; Transceivers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Low Power Electronics, 1994. Digest of Technical Papers., IEEE Symposium
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-1953-2
Type :
conf
DOI :
10.1109/LPE.1994.573188
Filename :
573188
Link To Document :
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