• DocumentCode
    2754167
  • Title

    Low-power RF-ICs in wireless transceivers

  • Author

    Abidi, A.A.

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
  • fYear
    1994
  • fDate
    10-12 Oct. 1994
  • Firstpage
    18
  • Lastpage
    21
  • Abstract
    This paper presents a brief survey of the highlights in the application of IC technology to radios since the 1970s, and follows this with trends of what the author considers is the shape of things to come in wireless transceivers over the next few years. RF-ICs are roughly defined as integrated circuits operating in the band of frequencies from 100 MHz to 2000 MHz which covers most consumer wireless devices. MMICs, by contrast, are small-scale ICs operating at tens of GHz which are almost exclusively fabricated on III-V compound semiconductor substrates. Driven by defence applications over the past decade, they have become an established discipline. RF-ICs are principally driven by consumer needs. They are, and will continue to be, fabricated mostly in mature silicon technologies, combining analog and digital functions at relatively large levels of integration. It is the authors belief that in response to pressing demands for ubiquitous wireless access, the day of the "VLSI radio" is not that far off.
  • Keywords
    UHF integrated circuits; 100 to 2000 MHz; RF IC design; Si; Si technologies; integrated circuits; large-scale integration; low-power RF ICs; power-reduction strategies; wireless transceivers; Application specific integrated circuits; Frequency; III-V semiconductor materials; Integrated circuit technology; MMICs; Pressing; Shape; Silicon; Substrates; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Power Electronics, 1994. Digest of Technical Papers., IEEE Symposium
  • Conference_Location
    San Diego, CA, USA
  • Print_ISBN
    0-7803-1953-2
  • Type

    conf

  • DOI
    10.1109/LPE.1994.573188
  • Filename
    573188