DocumentCode :
2754275
Title :
A study on the thermal reliability of high voltage MOSFET device
Author :
Lee, Hyun-Duck ; Yuk, Seung-Bum ; Lee, Jae-Hyeon ; Kwak, Jae-chang ; Kim, Kui-Dong ; Koo, Yong-Seo
Author_Institution :
Seokyeong Univ., Seoul
fYear :
2007
fDate :
Oct. 30 2007-Nov. 2 2007
Firstpage :
1
Lastpage :
4
Abstract :
In this study, the electrical characteristics of high voltage MOSFET(HV-MOSFET) under high temperature were investigated. And, specific on-resistance, threshold voltage, trans-conductance, drain current of the HV-MOSFET were measured over a temperature range of 300 K les T les 450 K. The results of this study indicate that extended drift region length has a great effect on electrical characteristics, but that is does little effect on temperature dependence. The specific on-resistance increases slightly with temperature. Especially, at high temperature(at 450 K), the specific on-resistance increase about 30% than that in room temperature. And, in high temperature condition (at 400 K), drain current decrease about 30%, Also, transconductance(gm) decreases with temperature.
Keywords :
MOSFET; semiconductor device reliability; drain current; high voltage MOSFET device; onresistance; thermal reliability; threshold voltage; trans-conductance; Current measurement; Electric variables; Electric variables measurement; MOSFET circuits; Scattering; Temperature distribution; Temperature measurement; Testing; Threshold voltage; Transconductance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
TENCON 2007 - 2007 IEEE Region 10 Conference
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-1272-3
Electronic_ISBN :
978-1-4244-1272-3
Type :
conf
DOI :
10.1109/TENCON.2007.4429013
Filename :
4429013
Link To Document :
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