DocumentCode :
2754419
Title :
IEEE 1500 Compatible Interconnect Test with Maximal Test Concurrency
Author :
Li, Katherine Shu-Min ; Liao, Yi-Yu ; Liu, Yuo-Wen ; Huang, Jr-Yang
Author_Institution :
Dept. of Comput. Sci. & Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
fYear :
2009
fDate :
23-26 Nov. 2009
Firstpage :
269
Lastpage :
274
Abstract :
On-chip interconnect structures become much more complicated and dominate system performance in multi-core SoCs. Oscillation ring test is an efficient test method for most types of faults in the interconnect structures, and previous studies show that a 100% fault coverage and good diagnosis resolution for various fault models is achievable. The test time of oscillation ring test is decided by the number of test sessions required to form all the rings. Previous method on ring generation algorithm uses depth-first-search (DFS) based method to generate long rings that may pass more uncovered edges. However, very few of the long rings can be put into the same test session, and thus the number of test sessions is not necessarily smaller. In this paper, we present several techniques to generate rings that can be tested concurrently. (1) Two ring generation algorithms are proposed to generate shorter rings that can be applied in parallel to reduce overall test time. (2) Multilevel framework is applied to optimize parallelism. Experimental results show that the proposed ring generation algorithms improve test application time by 2.25X, and with multilevel framework the improvement is 4.13X. All the ring generation algorithms achieve 100% interconnect fault coverage.
Keywords :
fault diagnosis; integrated circuit interconnections; integrated circuit testing; system-on-chip; IEEE 1500; interconnect fault coverage; interconnect test; maximal test concurrency; multi-core SoCs; multilevel framework; oscillation ring test; ring generation algorithm; system-on-chip; Circuit faults; Circuit testing; Concurrent computing; Delay; Electrical fault detection; Fault detection; Fault diagnosis; Integrated circuit interconnections; System testing; System-on-a-chip; interconnect; multilevel framework; system on chips; test session;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Asian Test Symposium, 2009. ATS '09.
Conference_Location :
Taichung
ISSN :
1081-7735
Print_ISBN :
978-0-7695-3864-8
Type :
conf
DOI :
10.1109/ATS.2009.67
Filename :
5359339
Link To Document :
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