DocumentCode
2754842
Title
Transaction Level Modeling and Design Space Exploration for SOC Test Architectures
Author
Chang, Chin-Yao ; Hsiao, Chih-Yuan ; Lee, Kuen-Jong ; Su, Alan P.
Author_Institution
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear
2009
fDate
23-26 Nov. 2009
Firstpage
200
Lastpage
205
Abstract
Transaction level modeling (TLM) provides a feasible methodology to model an SOC at a high abstraction level such that system level design issues can be dealt with efficiently. One of the issues that have not been well discussed at the transaction level is SOC testing. In this paper we address the problem of how to construct transaction level test architectures for SOC designs. We model the components required for SOC testing including embedded processor, memory, system bus as well as the test access mechanism, test bus, test wrappers and scan- or BIST-based IP cores. A case study on integrating these components into a test platform that can execute test procedures with very little external control is carried out. Experimental results show that 3 to 4 orders of magnitude improvement on simulation speed can be achieved compared with the RTL models. We also explore the design space of the test platform and show that various test architectures can be easily constructed and analyzed with this TLM methodology.
Keywords
VLSI; built-in self test; integrated circuit design; integrated circuit modelling; integrated circuit testing; microprocessor chips; system-on-chip; BIST-based IP core; SOC test architectures; VLSI; design space; design space exploration; embedded processor; memory; scan-based IP core; simulation speed; system bus; test access mechanism; test bus; test wrappers; transaction level modeling; Bandwidth; Delay; Design methodology; Integrated circuit testing; Performance evaluation; Signal design; Space exploration; System testing; System-level design; Throughput; Electronic system level (ESL); SOC testing; test architecture; test platform; transaction level modeling (TLM);
fLanguage
English
Publisher
ieee
Conference_Titel
Asian Test Symposium, 2009. ATS '09.
Conference_Location
Taichung
ISSN
1081-7735
Print_ISBN
978-0-7695-3864-8
Type
conf
DOI
10.1109/ATS.2009.33
Filename
5359358
Link To Document