• DocumentCode
    2755164
  • Title

    An Investigation of Grinding Process Optimization via Evolutionary Algorithms

  • Author

    Lee, T.S. ; Ting, T.O. ; Lin, Y.J.

  • Author_Institution
    Fac. of Eng. & Technol., Multimedia Univ., Malacca
  • fYear
    2007
  • fDate
    1-5 April 2007
  • Firstpage
    176
  • Lastpage
    181
  • Abstract
    In this paper, the performance of some evolutionary algorithms on grinding process optimization of silicon carbide (SiC) is investigated. The grinding of SiC is not an easy task due to its low fracture toughness, therefore making the material sensitive to cracking. The efficient grinding involves the optimal selection of operating parameters to maximize the material removal rate (MRR) while maintaining the required surface finish and limiting surface damage. In this work, optimization based on the available model has been carried out to obtain optimum parameters for silicon carbide grinding via three prominent evolutionary algorithms. They are particle swarm optimization (PSO), differential evolution (DE) and genetic algorithm (GA). The objective of this optimization process is to maximize the MRR, subject to surface finish and damage constraints of the grinding process. Numerical results show that PSO is comparatively superior in comparison with DE and GA algorithms for grinding process optimization in terms of its accuracy and convergent capability
  • Keywords
    carbon compounds; ceramics; genetic algorithms; grinding; particle swarm optimisation; silicon compounds; surface finishing; damage constraints; differential evolution; evolutionary algorithms; genetic algorithm; grinding process optimization; material removal rate; particle swarm optimization; silicon carbide; surface damage; surface finish; Ceramics; Evolutionary computation; Genetic algorithms; Machining; Rough surfaces; Silicon carbide; Surface cracks; Surface finishing; Surface roughness; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Swarm Intelligence Symposium, 2007. SIS 2007. IEEE
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    1-4244-0708-7
  • Type

    conf

  • DOI
    10.1109/SIS.2007.368043
  • Filename
    4223172