Title :
Low Overhead Time-Multiplexed Online Checking: A Case Study of An H.264 Decoder
Author :
Gao, Ming ; Kwang-Ting Cheng
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, Santa Barbara, CA, USA
Abstract :
To cope with increasing in-field failure rates for cost-sensitive electronic products, a low-overhead online checking methodology - Time-Multiplexed Online Checking (TMOC) - was proposed and demonstrated (see IEEE Asian Test Symposium, p.371-6, 2008). In this paper, we study the area overhead required for employing TMOC in an embedded field programmable gate array (eFPGA) core. The overheads caused by the relatively low logic density of eFPGA and the interface routing between a design module and its TMOC checker are examined in detail. In a case study of an H.264 decoder design, TMOC is compared to a dedicated duplication-based online checking scheme, which typically incurs more than 100% area overhead. Experimental results show that TMOC provides significant chip area overhead reduction for online checkers. A reduction of 68% is achieved when one checker is shared by 62 design partitions, for example. TMOC can also help reduce dynamic power overhead of online checking by increasing the number of partitions, at the cost of increased fault detection latency in some partitions.
Keywords :
decoding; digital signal processing chips; field programmable gate arrays; integrated circuit testing; logic testing; time division multiplexing; H.264 decoder; TMOC checker; chip area overhead reduction; cost-sensitive electronic products; dynamic power overhead reduction; eFPGA core; embedded field programmable gate array; in-field failure rates; interface routing; low overhead time-multiplexed online checking; Built-in self-test; Costs; Decoding; Delay; Electronic equipment testing; Fault detection; Field programmable gate arrays; Hardware; Programmable logic arrays; Redundancy; embedded FPGA; in-field failure; low-cost resilience; online testing; time-multiplexed;
Conference_Titel :
Asian Test Symposium, 2009. ATS '09.
Conference_Location :
Taichung
Print_ISBN :
978-0-7695-3864-8
DOI :
10.1109/ATS.2009.24