• DocumentCode
    2755394
  • Title

    Equivalent series and parallel equivalent circuits for metallized film capacitors

  • Author

    Brown, Robert W.

  • Author_Institution
    RMIT Univ., Melbourne
  • fYear
    2007
  • fDate
    Oct. 30 2007-Nov. 2 2007
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The most popular general purpose power and signal capacitor, the multilayer polypropylene (MPP) capacitor, exhibits virtually zero conductance losses and negligible distributed inductance. Self resonance is principally determined by lead and package inductance which can be modeled by a lumped equivalent inductor external to the capacitor. Inside the capacitor, the distributed resistance and capacitance represented by the metallization and the capacitance across the dielectric, correspond to an R-C transmission line with low pass characteristics. In this paper, distributed equivalent circuit modeling using numerical methods is used to derive empirical equations fitting the observed theoretical bode plots of equivalent capacitor parameters. The characterization of equivalent series and parallel components provides useful modeling tools for capacitor design and for predicting the effects of partial edge disconnection from the schooping due to corrosion or excessive current.
  • Keywords
    capacitance; capacitors; electric resistance; equivalent circuits; integrated circuit modelling; semiconductor device metallisation; R-C transmission line; distributed capacitance; distributed equivalent circuit modeling; distributed resistance; equivalent series; lumped equivalent inductor; metallization; metallized film capacitor; multilayer polypropylene capacitor; parallel equivalent circuit; self resonance; zero conductance losses; Capacitance; Dielectrics; Equivalent circuits; Inductance; Metallization; Nonhomogeneous media; Packaging; Power capacitors; Power transmission lines; Resonance; MPP; capacitor; cylindrical; model; parallel equivalent; series equivalent;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2007 - 2007 IEEE Region 10 Conference
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-1272-3
  • Electronic_ISBN
    978-1-4244-1272-3
  • Type

    conf

  • DOI
    10.1109/TENCON.2007.4429072
  • Filename
    4429072