A new packaging for DIP type thick film hybrid IC

Author

Shibuya, Hitoshi ; Kusaba, Kazunori ; Iida, Saburo ; Handa, Tohru ; Kanazawa, Masaru

Author_Institution

OKI Electr. Ind. Co. Ltd., Saitama, Japan

fYear

1989

fDate

26-28 Apr 1989

Firstpage

59

Lastpage

64

Abstract

The authors discuss a novel packaging method for DIP-(dual-in-line package-) type thick-film hybrid ICs presently used in digital electronic exchange equipment. This method has replaced previous packaging methods due to its economy and high reliability and because it allows automation. The package structure consists of a dam component and a filler component of silicone resin. Thick-film hybrid ICs packaged with this silicone resin showed good resistance properties after 1000 hours of 60°C, 90% relative humidity, 175-V DC bias testing. The bonding resistance between substrate and parts was unchanged after 100 cycles of a -25°C to 85°C thermal shock test

Keywords

circuit reliability; hybrid integrated circuits; integrated circuit technology; packaging; thick film circuits; -25 to 85 degC; 175 V; DIP type; bias testing; bonding resistance; dam component; dual-in-line; filler component; high reliability; packaging; silicone resin; thermal shock test; thick film hybrid IC; Digital integrated circuits; Electronic packaging thermal management; Electronics packaging; Hybrid integrated circuits; Integrated circuit packaging; Packaging machines; Resins; Testing; Thermal resistance; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International

Conference_Location

Nara

Type

conf

DOI

10.1109/IEMTS.1989.76110

Filename

76110