DocumentCode :
2756154
Title :
Bubble engineering for biomedical valving applications
Author :
Ki, Y. S Leung ; Kharouf, M. ; Van Lintel, H.T.G. ; Haller, M. ; Renaud, Ph
Author_Institution :
Inst. of Microsyst., Ecole Polytech. Fed. de Lausanne, Switzerland
fYear :
2000
fDate :
2000
Firstpage :
390
Lastpage :
393
Abstract :
Within the overall objective of developing a low dead volume technology for basic microfluidic valving, shunting and switching functionalities, the use of microbubbles is proposed. As a case study, a normally-closed, bubble-based microvalve design is presented. The valve, implemented using an all-Pyrex technology, can withstand high pressures limited only by the degree to which the vertical etch rate of Pyrex can be controlled. Measurements made on several prototypes show valve breaking pressures of approximately 180 kPa (gage) which closely match theoretically predicted values. A geometry-based trap is used to form bubbles of air with long persistence times (>24 hours). Presentation of the microvalve is followed by a general discussion of design and engineering issues surrounding the control and creation of microbubbles for microfluidic applications. Issues include bubble pinning at sharp transitions and inclusions, and actuation
Keywords :
biomedical equipment; bubbles; microfluidics; microvalves; 180 kPa; 24 h; actuation; all-Pyrex technology; basic microfluidic valving; biomedical valving applications; bubble engineering; bubble pinning; geometry-based trap; inclusions; low dead volume technology; persistence times; sharp transitions; shunting; switching; valve breaking pressures; vertical etch rate; Biomedical engineering; Degradation; Etching; Europe; Heat engines; Heat transfer; Microfluidics; Microvalves; Pressure control; Valves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microtechnologies in Medicine and Biology, 1st Annual International, Conference On. 2000
Conference_Location :
Lyon
Print_ISBN :
0-7803-6603-4
Type :
conf
DOI :
10.1109/MMB.2000.893812
Filename :
893812
Link To Document :
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