Title :
Application of TAB outer lead bonding technique for high lead count flat package IC assembly
Author :
Koga, Yasutaka ; Nakazono, Masakazu ; Iida, Mineaki
Author_Institution :
Toshiba Corp., Yokohama, Japan
Abstract :
A technique for bonding outer leads for a TAB (tape automated bonding) part onto inner leads for a metal lead frame has been employed to achieve high-lead-count and high-lead-density FPIC (flat package integrated circuit) assembly. An automated bonding machine that bonds all the outer leads simultaneously with high alignment accuracy has been developed. Tin-plated (35-μm-thick) copper TAB leads were connected to gold-plated nickel-alloy lead frames (0.15-mm thick) under 100°C preheat, 400 gf/lead bonding compression, and 450°C bonding heat for 1 s. Alignment accuracy ±36 μm was realized using 380000-pixel CCD cameras and original gray-scale image processing software. The authors present experimental results regarding the reliability of a quad flat package with 184-lead TAB
Keywords :
integrated circuit manufacture; integrated circuit technology; lead bonding; surface mount technology; 100 degC; 450 degC; Au plated Ni alloy microassembly; CCD cameras; FPIC; SMT; Sn plated Cu leads; TAB outer lead bonding; automated bonding machine; flat package IC assembly; gray-scale image processing software; high lead count; high-lead-density; inner leads; integrated circuit; metal lead frame; reliability; surface mounting; tape automated bonding; Assembly; Bonding; Charge coupled devices; Charge-coupled image sensors; Copper; Gray-scale; Image coding; Integrated circuit packaging; Lead; Packaging machines;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
Conference_Location :
Nara
DOI :
10.1109/IEMTS.1989.76111
