• DocumentCode
    2756323
  • Title

    The thermal effects on deformation processes of the porous materials

  • Author

    Punantapong, Boonyong

  • Author_Institution
    Dept. of Ind. Phys. & Med. Instrum., King Mongkut´´s Inst. of Technol., Bangkok, Thailand
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    435
  • Lastpage
    438
  • Abstract
    The modeling of the behavior of porous media has received considerable attention in recent years due not only to its theoretical interest but also to broad technological applications concerning materials such as ceramics, composite materials, bone, and other biological tissues. However, many engineering materials contain defects in the form of cracks, voids and inclusions that can significantly affect their load carrying capabilities. Damage is easily initiates as micro-cracks around an inclusion due to the residual stresses and thermal mismatch between inclusion and matrix properties. Here, the authors are concerned with damaged materials, which due to straining are submitted to modifying microstructure processes, coalescence of voids, and microcracks. The damage phenomenon leads to a progressive deterioration of the material in the sense that its resisting capacity to subsequent loading is diminished. Finally, the computational significance of the model for state-update algorithms is analyzed the context of an explicit time-marching scheme
  • Keywords
    biological tissues; biomechanics; biomedical materials; bone; ceramics; composite materials; deformation; inclusions; internal stresses; microcracks; modelling; porous materials; voids (solid); damage phenomenon; deformation processes; explicit time-marching scheme; load carrying capabilities; matrix properties; modifying microstructure processes; porous media behavior modeling; progressive deterioration; residual stresses; resisting capacity; state-update algorithms; thermal effects; thermal mismatch; voids coalescence; Biological materials; Biological system modeling; Biological tissues; Bones; Ceramics; Composite materials; Context modeling; Microstructure; Residual stresses; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microtechnologies in Medicine and Biology, 1st Annual International, Conference On. 2000
  • Conference_Location
    Lyon
  • Print_ISBN
    0-7803-6603-4
  • Type

    conf

  • DOI
    10.1109/MMB.2000.893822
  • Filename
    893822