Title :
High-Speed, Short-Latency Multipath Ethernet Transport for Interconnections
Author :
Enomoto, Nobuyuki ; Shimonishi, Hideyuki ; Higuchi, Junichi ; Yoshikawa, Takashi ; Iwata, Atsushi
Author_Institution :
Syst. Platforms Res. Labs., NEC Corp., Tokyo
Abstract :
In this paper, we propose an Ethernet-based transmission-guaranteed, congestion-controlled network using a simplified multi-path aggregation scheme. Multi-path aggregation increases throughput by multiplying the bandwidth of a single path by the number of paths. There are several aggregation schemes, such as Link Aggregation and Multi-path TCP. However, Link Aggregation is unable to utilize multiple paths to increase throughput because it distributes a single flow only into a single path, The Multi-path TCP scheme requires managing two stages of sequence numbers (SEQ) (i.e., the SEQ assigned to a path and the SEQ assigned to the flow). This complexity requires software-based implementation, which means the method fails to provide high throughput and short latency. We therefore propose a single-stage sequence number scheme with a reorder-buffer-usage-based retransmission-activating algorithm. Hardware implementation of this scheme is very simple. In addition, packet-loss detection is rapid. Our simulation and experimental results showed that our scheme provided a high-throughput, short-latency, and transmission-guaranteed network over conventional, lossy, delay-fluctuated, and best-effort Ethernet.
Keywords :
local area networks; multipath channels; telecommunication links; transport protocols; congestion-controlled network; high-speed multipath Ethernet transport; link aggregation; multipath aggregation scheme; packet-loss detection; short-latency multipath Ethernet transport; single-stage sequence number scheme; transmission-guaranteed network; Bandwidth; Computational modeling; Delay; Ethernet networks; Hardware; Laboratories; National electric code; Propagation losses; Throughput; Tunneling; Ethernet; Interconnection; Multipath; PCI-Express;
Conference_Titel :
High Performance Interconnects, 2008. HOTI '08. 16th IEEE Symposium on
Conference_Location :
Stanford, CA
Print_ISBN :
978-0-7695-3380-3
DOI :
10.1109/HOTI.2008.13