• DocumentCode
    2756835
  • Title

    WSDL-D: A Flexible Web Service Invocation Mechanism for Large Datasets

  • Author

    Wiley, Mark ; Wu, Aihua ; Su, Jianwen

  • Author_Institution
    Dept. of Comput. Sci., UC Santa Barbara, Santa Barbara, CA
  • fYear
    2008
  • fDate
    21-24 July 2008
  • Firstpage
    157
  • Lastpage
    164
  • Abstract
    WSDL Web services are built around the request-reply framework, requiring service invocation to be bundled together with all relevant data in a single message. Inefficiency becomes evident as Web service providers begin to offer more robust services that require massive datasets (e.g., multimedia and scientific data). Under the WSDL standards, these hefty datasets must be ported to an appropriate message format and transferred in their entirety upon each service invocation or response. Significant gains in service flexibility and performance can be made simply by separating invocation messages from their datasets. Such a separation ultimately grants service consumers the ability to pass parameter datasets from third party hosts, to maintain dataset parameters on the service provider host for use with future service invocations, and to provide datasets in a variety of different formats. In this paper, we develop a service invocation mechanism, called WSDL-D, to support this separation of service invocation from parameter datasets.
  • Keywords
    Web services; XML; very large databases; WSDL standard; WSDL-D; Web Services Description Language; Web service; dataset parameter; invocation message; large dataset; request-reply framework; service flexibility; service invocation; service performance; Catalogs; Couplings; Multimedia databases; Multimedia systems; Packaging; Performance gain; Prototypes; Robustness; Web services; XML; Web services; invocation; large data set; protocols;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    E-Commerce Technology and the Fifth IEEE Conference on Enterprise Computing, E-Commerce and E-Services, 2008 10th IEEE Conference on
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-0-7695-3340-7
  • Type

    conf

  • DOI
    10.1109/CECandEEE.2008.150
  • Filename
    4785059