Two free air convection and radiation thermal models for planar magnetic components

Thermal is considered as a principal constraint in size reduction of passive components in power electronics. In fact, the maximum temperature rise of component must be kept under a limit that heat dissipation cannot destroy the device materials. Therefore thermal modelling has to be taken in design optimisation of the components. We propose, in this paper, two analytical thermal models of free convection and radiation that can be applied to planar magnetic components. The models are verified by experimental tests, advantages and weakness of each model are analyzed to find out an appropriate one using in optimization tools.