• DocumentCode
    2757254
  • Title

    Association Rule Based Context Modeling for Web Service Discovery

  • Author

    Rong, Wenge ; Liu, Kecheng ; Liang, Lin

  • Author_Institution
    Inf. Res. Centre, Univ. of Reading, Reading
  • fYear
    2008
  • fDate
    21-24 July 2008
  • Firstpage
    299
  • Lastpage
    304
  • Abstract
    Web service is essential in achieving dynamic business process. With the dramatically increased number of Web services advertised in UDDI, Web Portal or Internet, how to locate the best Web service according to a user´s requirement is becoming more and more important, which calls for efficient and effective Web service discovery mechanism. Considerable efforts have been attained in solving this problem among them semantic based approaches show encouraging result. However, when several semantically equivalent Web service candidates are returned by matchmaking process, how to discern which one is the most suitable one is a real challenge. This paper presents a framework by which provider´s context and user´s context has been explored to help understand the real need of a user. This framework uses association rule for context modeling of provider and user from Web service composition perspective. After modeling context, a ranking service is invoked to compare Web service candidates with user´s requirement and then the best suitable potential Web service will be selected.
  • Keywords
    Web services; data mining; portals; Internet; UDDI; Web portal; Web service composition; Web service discovery; association rule based context modeling; dynamic business process; ranking service; user requirement; Association rules; Context modeling; Context-aware services; Informatics; Portals; Terminology; Vehicle dynamics; Vehicles; Web and internet services; Web services; Context; Ranking; Web service;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    E-Commerce Technology and the Fifth IEEE Conference on Enterprise Computing, E-Commerce and E-Services, 2008 10th IEEE Conference on
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-0-7695-3340-7
  • Type

    conf

  • DOI
    10.1109/CECandEEE.2008.137
  • Filename
    4785078