Dielectric response of filled and flexibilized epoxy resin

In this work, several nanostructured microcomposite epoxy resin compounds, with or without flexibilized network, are analyzed. Scanning Electron Microscopy is used for the investigation of the phase separation between the flexibilizer and the polymer matrix. Differential Scanning Calorimetry results showed an enhanced molecular mobility for the polymer chains confirmed the expected influence of the flexibilizer. Also, the addition of micro and nanoparticles into epoxy resin increased the glass transition temperature since the fillers prevent the molecular movement of the polymeric chains. Broadband Dielectric Spectroscopy allowed us to determine the influence of the flexibilizer and the influence of the nano and micro filler ratio on the relaxation time versus temperature. After fitting the relaxation peaks using Havriliak-Negami functions, noticeable differences were observed for the β relaxation processes.