• DocumentCode
    2757544
  • Title

    Short-distance interconnection bandwidth: the scarce resource

  • Author

    Towe, E.

  • Author_Institution
    Defense Adv. Res. Projects Agency, Arlington, VA, USA
  • Volume
    2
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    421
  • Abstract
    We discuss the progress, challenges, and projections for short-distance optical interconnections. It will focus on hardware packaging issues. The paper will also introduce the notion that new systems architectures are needed to take advantage of the high communication bandwidth available in the new modality of interconnection
  • Keywords
    VLSI; integrated circuit packaging; multichip modules; optical interconnections; hardware packaging issues; high communication bandwidth; interconnection modality; short-distance interconnection bandwidth; short-distance optical interconnections; systems architectures; Bandwidth; Fiber lasers; Logic; Optical arrays; Optical interconnections; Photonics; Semiconductor lasers; Silicon; Stimulated emission; Vertical cavity surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE
  • Conference_Location
    Rio Grande
  • ISSN
    1092-8081
  • Print_ISBN
    0-7803-5947-X
  • Type

    conf

  • DOI
    10.1109/LEOS.2000.893892
  • Filename
    893892
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2757544