DocumentCode
2757655
Title
FMEA without fear AND tear
Author
Suganthi, S. ; Kumar, D.
Author_Institution
Dept. of Electron. & Commun. Eng., Shri Angalamman Coll. of Eng. & Technol., Tiruchirappalli, India
fYear
2010
fDate
2-5 June 2010
Firstpage
1118
Lastpage
1123
Abstract
This paper aims at applying simplified FMEA (Failure Modes and Effects Analysis), to electronic products for better quality. The procedure has five important steps. Studying the product and identifying failure modes are the pre-work and performing, analyzing and continuing FMEA remain the post-work. In SSIs(small scale industries), the work nature creates fear on use of detailed FMEA among employees. Adapting sophisticated software is beyond the budget of such industries. If FMEA is willingly performed in all stages, it might lead to tear due to limitations. Though flexible, its enlarged application throughout, requires skilled employees, more time, money and effort. The proposed modeling enunciated SIPAC(study, identify, perform, analyze and continue) provides solution, being simple and sleek based on needs of SSIs.
Keywords
electronic products; failure analysis; FMEA; SIPAC modeling; effects analysis; electronic products; failure modes; Application software; Computer industry; Condition monitoring; Consumer electronics; Educational institutions; Failure analysis; Performance analysis; Process design; Risk analysis; Software maintenance; CI; Check sheet; DUA; FMEA; RPN; SIPAC modeling; Success%; fmea table (excel worksheet);
fLanguage
English
Publisher
ieee
Conference_Titel
Management of Innovation and Technology (ICMIT), 2010 IEEE International Conference on
Conference_Location
Singapore
Print_ISBN
978-1-4244-6565-1
Electronic_ISBN
978-1-4244-6566-8
Type
conf
DOI
10.1109/ICMIT.2010.5492899
Filename
5492899
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