• DocumentCode
    2757655
  • Title

    FMEA without fear AND tear

  • Author

    Suganthi, S. ; Kumar, D.

  • Author_Institution
    Dept. of Electron. & Commun. Eng., Shri Angalamman Coll. of Eng. & Technol., Tiruchirappalli, India
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1118
  • Lastpage
    1123
  • Abstract
    This paper aims at applying simplified FMEA (Failure Modes and Effects Analysis), to electronic products for better quality. The procedure has five important steps. Studying the product and identifying failure modes are the pre-work and performing, analyzing and continuing FMEA remain the post-work. In SSIs(small scale industries), the work nature creates fear on use of detailed FMEA among employees. Adapting sophisticated software is beyond the budget of such industries. If FMEA is willingly performed in all stages, it might lead to tear due to limitations. Though flexible, its enlarged application throughout, requires skilled employees, more time, money and effort. The proposed modeling enunciated SIPAC(study, identify, perform, analyze and continue) provides solution, being simple and sleek based on needs of SSIs.
  • Keywords
    electronic products; failure analysis; FMEA; SIPAC modeling; effects analysis; electronic products; failure modes; Application software; Computer industry; Condition monitoring; Consumer electronics; Educational institutions; Failure analysis; Performance analysis; Process design; Risk analysis; Software maintenance; CI; Check sheet; DUA; FMEA; RPN; SIPAC modeling; Success%; fmea table (excel worksheet);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Management of Innovation and Technology (ICMIT), 2010 IEEE International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-6565-1
  • Electronic_ISBN
    978-1-4244-6566-8
  • Type

    conf

  • DOI
    10.1109/ICMIT.2010.5492899
  • Filename
    5492899