DocumentCode :
2758014
Title :
Quantifying the operational benefits of new HV cable systems in terms of dielectric design parameters
Author :
Pilgrim, J.A. ; Lewin, P.L. ; Vaughan, A.S.
Author_Institution :
Tony Davies High Voltage Lab., Univ. of Southampton, Southampton, UK
fYear :
2012
fDate :
10-13 June 2012
Firstpage :
261
Lastpage :
265
Abstract :
In recent years, a significant volume of work has been undertaken on the development of novel dielectric materials which offer improvements in a variety of properties. Questions are frequently asked as to how particular properties can be improved by more intelligent dielectric design. However from the point of view of the network operator it is not just the dielectric design which is of interest - rather, how the finished product performs in the network. This paper seeks to demonstrate what quantifiable improvements in cable performance could be gained through advances in the dielectric properties of cable systems. The analysis is set in the context of the operational current rating of the cable circuit and the associated losses per unit of power transferred. Analysis of the results shows that the greatest improvement in cable operational performance can be made from increasing the dielectric thermal conductivity, even if it comes at the expense of a slight decrease in other properties.
Keywords :
dielectric materials; dielectric properties; power cables; thermal stability; HV cable systems; cable circuit; dielectric design parameter; dielectric material development; dielectric properties; dielectric thermal conductivity; intelligent dielectric design; operational current rating; Cable insulation; Conductivity; Conductors; Dielectric losses; Thermal conductivity; Thermal resistance; current rating; dielectric design; transmission cables;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation (ISEI), Conference Record of the 2012 IEEE International Symposium on
Conference_Location :
San Juan, PR
ISSN :
1089-084X
Print_ISBN :
978-1-4673-0488-7
Electronic_ISBN :
1089-084X
Type :
conf
DOI :
10.1109/ELINSL.2012.6251469
Filename :
6251469
Link To Document :
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