• DocumentCode
    2758204
  • Title

    Is Foundry only a capacity provider still?: Relations of role playing for semiconductor industry value chain by patent analysis

  • Author

    Li, Yung-Ta ; Huang, Mu-Hsuan ; Chen, Dar-Zen

  • Author_Institution
    Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    220
  • Lastpage
    225
  • Abstract
    Foundry, Design House, and IDM are 3 major roles in the semiconductor industry value chain. This study used patent analysis to explore the technology level for the different role playing of the semiconductor industry value chain for past nearly 30 years. The research team applied many crucial techniques on patent analysis, along with patent citation network analysis, to find out the evolution for different roles in different technology eras. IDM got the leading position whether on patent number or patent cited times, but Foundry made impressive progress on the growth rate from the 6-inch wafer size era to the 12-inch wafer size era. That is, Foundry served not only as manufacturing capacity providers traditionally but also as technology donators gradually. From the patent citation network, it could be found that the relationship between Foundry and IDM is stronger than that of Foundry and Design House.
  • Keywords
    citation analysis; foundries; patents; semiconductor industry; Foundry; design house; integrated device manufacturers; manufacturing capacity providers; patent analysis; patent citation network analysis; patent cited times; patent number; semiconductor industry value chain; Citation analysis; Electronics industry; Foundries; Information analysis; Knowledge transfer; Libraries; Manufacturing industries; Mechanical engineering; Research and development; Semiconductor device manufacture; Co-opetition; Design House; Foundry; IDM; Patent Citation; Patent Citation Network;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Management of Innovation and Technology (ICMIT), 2010 IEEE International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-6565-1
  • Electronic_ISBN
    978-1-4244-6566-8
  • Type

    conf

  • DOI
    10.1109/ICMIT.2010.5492927
  • Filename
    5492927