DocumentCode :
2758285
Title :
Simulating insulation systems under various environmental conditions in the laboratory
Author :
McKinnon, David L.
Author_Institution :
PdMA Corp., Tampa, FL, USA
fYear :
2012
fDate :
10-13 June 2012
Firstpage :
336
Lastpage :
340
Abstract :
Over the last century as electrical motor testing became prominent in industry, little research has been published on simulating insulation systems in various environmental conditions such as moisture and contamination that are found in the field. In this paper, summary results of research performed using simulation software to simulate insulation systems in various environmental conditions that may be experienced in the field are presented. All simulations are based on actual nominal Insulation Resistance Profiles (IRP) obtained during a standard Polarization Index (PI) Test on motors (not containing stress graded systems). Once a nominal profile is obtained, the effects of changing various parameters of the standard insulation system model such as resistance-to-ground, and capacitance-to-ground, to simulate various environmental conditions are examined. Lastly, simulation results are compared to actual field case studies using some of the four basic Insulation Resistance Profiles (Nominal, Moisture, Contamination, and Embrittlement).
Keywords :
electric motors; machine insulation; machine testing; capacitance-to-ground; contamination insulation resistance profile; electrical motor testing; embrittlement insulation resistance profile; environmental conditions; insulation system simulation; moisture insulation resistance profile; nominal insulation resistance profile; resistance-to-ground; simulation software; standard insulation system model; standard polarization index test; Absorption; Capacitance; Contamination; Insulation; Integrated circuit modeling; Moisture; Resistance; Insulation Resistance; Insulation Resistance Profile (IRP); Megger; Polarization Index; Resistance-to-Ground;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation (ISEI), Conference Record of the 2012 IEEE International Symposium on
Conference_Location :
San Juan, PR
ISSN :
1089-084X
Print_ISBN :
978-1-4673-0488-7
Electronic_ISBN :
1089-084X
Type :
conf
DOI :
10.1109/ELINSL.2012.6251485
Filename :
6251485
Link To Document :
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