Advanced power module packaging for increased operation temperature and power density

Power Electronics is a key enabling technology for the effective and efficient generation, distribution, and use of electrical energy. In the range of kW to MW, power semiconductor modules play a key role in power electronic systems. While in the past decade the R&D activities mainly concentrated on continuous improvement of materials and production processes, more drastic technology changes are emerging nowadays. This is driven by the urgent need for much higher power densities, for higher reliability and further cost reduction. Also the requirements imposed by wide band gap semiconductors need now seriously to be addressed. Therefore, this paper presents an overview of recent material, process and technology developments which enable such improvements. In particular, the latest innovations in die attach technologies as well as the potential of direct liquid cooling and system integration will be highlighted.