Title :
The adhesiveless polyimide laminate as a circuitry material
Author_Institution :
Sumitomo Bakelite Co. Ltd., Tokyo, Japan
Abstract :
Using a casting method, two-layer, flexible, printed-circuit materials were developed. The CTE (coefficient of thermal expansion) matching problem was solved by polyimide molecule design. Residual stress resulting from imidization and vaporization was relaxed sufficiently by process design. The polyimide laminate has high heat resistance, good dimensional stability, and excellent electrical properties. The wire-bonding technique can be used without any difficulty. Applications include flat antennas and tape automated bonding
Keywords :
casting; laminates; polymers; printed circuit manufacture; CTE; adhesiveless polyimide laminate; casting method; dimensional stability; electrical properties; flat antennas; heat resistance; imidization; polyimide molecule design; printed-circuit materials; tape automated bonding; vaporization; wire-bonding technique; Bonding; Casting; Circuit stability; Electric resistance; Laminates; Polyimides; Process design; Residual stresses; Resistance heating; Thermal expansion;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
Conference_Location :
Nara
DOI :
10.1109/IEMTS.1989.76123
