DocumentCode
2758473
Title
The adhesiveless polyimide laminate as a circuitry material
Author
Nakao, Toshio
Author_Institution
Sumitomo Bakelite Co. Ltd., Tokyo, Japan
fYear
1989
fDate
26-28 Apr 1989
Firstpage
132
Lastpage
135
Abstract
Using a casting method, two-layer, flexible, printed-circuit materials were developed. The CTE (coefficient of thermal expansion) matching problem was solved by polyimide molecule design. Residual stress resulting from imidization and vaporization was relaxed sufficiently by process design. The polyimide laminate has high heat resistance, good dimensional stability, and excellent electrical properties. The wire-bonding technique can be used without any difficulty. Applications include flat antennas and tape automated bonding
Keywords
casting; laminates; polymers; printed circuit manufacture; CTE; adhesiveless polyimide laminate; casting method; dimensional stability; electrical properties; flat antennas; heat resistance; imidization; polyimide molecule design; printed-circuit materials; tape automated bonding; vaporization; wire-bonding technique; Bonding; Casting; Circuit stability; Electric resistance; Laminates; Polyimides; Process design; Residual stresses; Resistance heating; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
Conference_Location
Nara
Type
conf
DOI
10.1109/IEMTS.1989.76123
Filename
76123
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