DocumentCode :
2758509
Title :
Modeling and Evaluating the Performance of the Bufferless Optical Interconnection Network (BOIN)
Author :
Qi Xingyun ; Dou Qiang ; Feng Quanyou ; Chen Yongran ; Jun, Wen ; Wenhua, Dou
Author_Institution :
Coll. of Comput., Nat. Univ. of Defense Technol., Changsha, China
Volume :
2
fYear :
2009
fDate :
25-26 July 2009
Firstpage :
81
Lastpage :
85
Abstract :
Most of the present optical interconnect networks within the high performance computers require either the buffering and opto-electonic conversion of the data packets or the pre-assigning of the optical path from the source to destination, which to a certain extent influence the performance metrics such as latency and throughput. Aiming at the limitation mentioned above, a hybrid optical-electrical interconnection for high performance computer system named bufferless optical interconnection network (BOIN) is brought forward. Basing on the topology and link control protocol of the BOIN, a performance model is setup. According to this model, the network throughput and delay are analyzed and evaluated. Simulation shows that BOIN has advantages over the other two networks. It can deliver high throughput at low latency, which can well satisfy the need for high performance computing systems.
Keywords :
optical interconnections; optoelectronic devices; protocols; BOIN; bufferless optical interconnection network; computing systems; data packets; hybrid optical-electrical interconnection; link control protocol; optical path; opto-electonic conversion; Computer networks; Delay; High performance computing; Measurement; Network topology; Optical buffering; Optical computing; Optical fiber networks; Optical interconnections; Throughput; high performance computer; network performance model; optical interconnection network; performance evaluation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Information Technology and Computer Science, 2009. ITCS 2009. International Conference on
Conference_Location :
Kiev
Print_ISBN :
978-0-7695-3688-0
Type :
conf
DOI :
10.1109/ITCS.2009.155
Filename :
5190187
Link To Document :
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