• DocumentCode
    2758604
  • Title

    A Survey Of Critical Metrology Needs For IC Interconnect Processes Based On Assessment By Quality Function Deployment (qfd) Methodology

  • Author

    Pope, D. Elaine ; Prough, Steve ; Wieneke, Kurt

  • fYear
    1993
  • fDate
    9-11 Jun 1993
  • Firstpage
    155
  • Lastpage
    160
  • Keywords
    Bonding; Inspection; Metrology; Packaging; Process planning; Quality function deployment; Semiconductor device measurement; Technology planning; Testing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
  • Print_ISBN
    0-7803-1432-8
  • Type

    conf

  • DOI
    10.1109/IEMT.1993.639739
  • Filename
    639739
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2758604