Title :
A Survey Of Critical Metrology Needs For IC Interconnect Processes Based On Assessment By Quality Function Deployment (qfd) Methodology
Author :
Pope, D. Elaine ; Prough, Steve ; Wieneke, Kurt
Keywords :
Bonding; Inspection; Metrology; Packaging; Process planning; Quality function deployment; Semiconductor device measurement; Technology planning; Testing; Wire;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639739
