A technology for high density mounting utilizing polymeric multilayer substrate

The authors describe a novel mounting technique for producing a high-density functional module that includes new polymeric substrate technology. The module consists of three parts: the multilayer substrate, the block including the electrical parts, and the thin-film resistor sheet. A polycarbonate resin film was selected as the substrate. A conductive paste made from silver powder and thermoplastic resin binder was printed on the polycarbonate resin film. These films are piled up and laminated by thermal press. The parts are placed and molded into a block shape with UV curing resin. The resistor layer is formed by sputtering a thin NiCr film on the polyimide-resin-coated stainless steel plate. The parts block and the resistor sheet are properly aligned with the substrate and bonded to each other with an adhesive resin