Tape on substrate, a new systems approach for manufacturing multilayer hybrid circuits

Author

Patterson, F.K. ; Gantzhorn, J.E. ; Daly, T.P. ; Rellick, J.R. ; Iwabuchi, M. ; Kawasaki, S.

Author_Institution

Du Pont Co., Wilmington, DE, USA

fYear

1989

fDate

26-28 Apr 1989

Firstpage

147

Lastpage

151

Abstract

The authors describe a reliable and potentially cost-effective system of dielectric tape, conventional thick film conductors, and process technology for manufacturing low-layer-count multilayer circuits on alumina substrates. The overall system is designated as tape on substrate (TOS). The materials system and process steps for this system, representing an easy entry-level technology for thick-film hybrid circuit manufacturers, are described in detail. Potential circuit manufacturing concepts for high-volume production are also examined

Keywords

hybrid integrated circuits; integrated circuit technology; thick film circuits; Al₂O₃; circuit manufacturing concepts; dielectric tape; high-volume production; low-layer-count multilayer circuits; multilayer hybrid circuits; process technology; systems approach; tape on substrate; thick film conductors; thick-film hybrid circuit; Ceramics; Circuits; Conducting materials; Conductive films; Conductors; Dielectric substrates; Manufacturing; Nonhomogeneous media; Silver; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International

Conference_Location

Nara

Type

conf

DOI

10.1109/IEMTS.1989.76126

Filename

76126