• DocumentCode
    2759468
  • Title

    Application of aluminium-alloy ultrahigh vacuum system to semiconductor device fabrication processes

  • Author

    Suemitsu, Maki ; Miyamoto, Nobuo

  • Author_Institution
    Res. Inst. of Electr. Commun., Tohoku Univ., Sendai, Japan
  • fYear
    1989
  • fDate
    26-28 Apr 1989
  • Firstpage
    172
  • Lastpage
    175
  • Abstract
    The aluminium-alloy ultra-high-vacuum (UHV) system has been shown to possess several excellent vacuum properties, such as an extremely low outgassing rate and an extremely short pumpdown time to reach the UHV region. It has, therefore, a considerable potential as a UHV system for next-generation semiconductor processes. For this application, however, proper surface treatments must be applied to the inner surface of the chamber, depending on the environment created by the process. A lathing method that utilizes alcohols as the lathing liquid has been developed for this purpose and found to be effective for processes that do not contain corrosive species. A silicon molecular beam epitaxy (MBE) chamber has been constructed with this method, and its vacuum properties were tested. For processes that contain corrosive species, ceramic coating was tested and found effective
  • Keywords
    molecular beam epitaxial growth; semiconductor growth; semiconductor technology; vacuum apparatus; vacuum techniques; corrosive species; lathing method; molecular beam epitaxy; outgassing rate; pumpdown time; semiconductor device fabrication processes; surface treatments; ultrahigh vacuum system; Aluminum alloys; Fabrication; Molecular beam epitaxial growth; Semiconductor devices; Semiconductor materials; Surface treatment; Testing; Thermal conductivity; Vacuum systems; Vacuum technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
  • Conference_Location
    Nara
  • Type

    conf

  • DOI
    10.1109/IEMTS.1989.76132
  • Filename
    76132