Abstract :
The following topics are dealt with: interconnect technology; material; 3D IC; TSV; back end memory; packaging; reliability; and integration.
Keywords :
electronics packaging; integrated circuit interconnections; integrated circuit reliability; integrated memory circuits; three-dimensional integrated circuits; 3D IC; TSV; back end memory; integration; interconnect technology; material; packaging; reliability;
Conference_Titel :
Interconnect Technology Conference (IITC), 2012 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4673-1138-0
Electronic_ISBN :
pending
DOI :
10.1109/IITC.2012.6251558
