DocumentCode
2759720
Title
Influence of the heat sink orientation and fins arrangement on the thermal behavior of high power LED
Author
Teeba, N. ; Anithambigai, P. ; Dinash, K. ; Mutharasu, D.
Author_Institution
Nano Opto Electron. Lab., Univ. Sains Malaysia (USM), Minden, Malaysia
fYear
2011
fDate
19-20 July 2011
Firstpage
21
Lastpage
24
Abstract
Heat management in Light Emitting Diodes (LED) is necessary to enhance its optical performance and stability. The usage of external heat sink is one of the efficient ways to reduce the thermal effect on the LED packages at low cost.
Keywords
heat sinks; light emitting diodes; thermal analysis; thermal management (packaging); LED packages; external heat sink; fins arrangement; heat management; heat sink orientation; high power LED; light emitting diodes; optical performance; optical stability; thermal behavior; thermal effect; Artificial intelligence; Heat sinks; Junctions; Phosphors; Reliability engineering; Resistance; Junction temperature; Structure function; Thermal resistance; Thermal transient measurement; heat sink;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ASQED), 2011 3rd Asia Symposium on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4577-0145-0
Type
conf
DOI
10.1109/ASQED.2011.6111696
Filename
6111696
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