Title :
Influence of the heat sink orientation and fins arrangement on the thermal behavior of high power LED
Author :
Teeba, N. ; Anithambigai, P. ; Dinash, K. ; Mutharasu, D.
Author_Institution :
Nano Opto Electron. Lab., Univ. Sains Malaysia (USM), Minden, Malaysia
Abstract :
Heat management in Light Emitting Diodes (LED) is necessary to enhance its optical performance and stability. The usage of external heat sink is one of the efficient ways to reduce the thermal effect on the LED packages at low cost.
Keywords :
heat sinks; light emitting diodes; thermal analysis; thermal management (packaging); LED packages; external heat sink; fins arrangement; heat management; heat sink orientation; high power LED; light emitting diodes; optical performance; optical stability; thermal behavior; thermal effect; Artificial intelligence; Heat sinks; Junctions; Phosphors; Reliability engineering; Resistance; Junction temperature; Structure function; Thermal resistance; Thermal transient measurement; heat sink;
Conference_Titel :
Quality Electronic Design (ASQED), 2011 3rd Asia Symposium on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4577-0145-0
DOI :
10.1109/ASQED.2011.6111696
