Title :
Packaging of laser array modules in flip-chip bonding
Author :
Wu, W.J. ; Guo, Y.D. ; Chiu, T.H. ; Yuang, R.H. ; Chu, M.T. ; Hsieh, C.H. ; Cheng, W.H.
Author_Institution :
Opto-Electron. & Syst. Labs., ITRI, Hsinchu, Taiwan
Abstract :
We have developed low-cost laser array modules using a passive self-aligned flip-chip bonding technique. A 4-channel laser array was flip-chip mounted with coupling efficiency of 44% to cleaved 50/125 μm multimode fiber ribbons. The average misalignment was measured 3 μm for laser array flip-chip bonding by using metallographic analysis
Keywords :
flip-chip devices; modules; packaging; semiconductor laser arrays; 44 percent; cleaved multimode fiber ribbon; coupling efficiency; laser array module; metallographic analysis; misalignment measurement; packaging; passive self-aligned flip-chip bonding; Bonding; Costs; Fiber lasers; Geometrical optics; Optical arrays; Optical coupling; Optical films; Packaging; Semiconductor laser arrays; Sputtering;
Conference_Titel :
Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE
Conference_Location :
Rio Grande
Print_ISBN :
0-7803-5947-X
DOI :
10.1109/LEOS.2000.894021
