• DocumentCode
    2760007
  • Title

    Power - Reliability tradeoff in low power 4-PAM signaling in on-chip communication

  • Author

    Forooshani, Arash Abtahi ; Rokhani, Fakhrul Zaman ; Samsudin, Khairulmizam ; Behzadipour, Hamid

  • Author_Institution
    Dept. of CCSE, Univ. Putra Malaysia, Serdang, Malaysia
  • fYear
    2011
  • fDate
    19-20 July 2011
  • Firstpage
    109
  • Lastpage
    114
  • Abstract
    The higher data rates at low power consumption have recently directed attentions towards on/off-chip multilevel signaling. However, its tighter noise margin cost leads to reliability concern. In this work, the reliability issue for multilevel signaling is highlighted using 4-PAM scheme. Three cost-effective architectures based on Hamming codes are synthesized in 45-nm technology to analyze the tradeoffs between reliability improvement and power consumption. Results showed that the 8-(7,4) configuration can enhance the 4-PAM signaling performance more than 3.3-dB at the Bit Error Rate of 10-6 while reducing power consumption up to 58% against binary for a 10-mm global on-chip interconnect. Furthermore, it is shown that higher levels of reliability are achievable at the cost of lower power savings. This paper provides guidelines to the designers for selecting between signaling schemes given the design characteristics and constraints.
  • Keywords
    Hamming codes; error statistics; fault tolerance; integrated circuit interconnections; integrated circuit reliability; microprocessor chips; signalling; Hamming code; bit error rate; cost-effective architecture; low power consumption; low-power 4-PAM signaling; off-chip multilevel signaling; on-chip communication; on-chip interconnection; power consumption; power reliability tradeoff; power saving cost; reliability improvement; size 10 mm; size 45 nm; Bit error rate; Encoding; Forward error correction; Noise; Power demand; Reliability; Wires; Fault Tolerant Technique; Forward Error Correction; Low Power On-Chip Communication; Multilevel Signaling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ASQED), 2011 3rd Asia Symposium on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4577-0145-0
  • Type

    conf

  • DOI
    10.1109/ASQED.2011.6111711
  • Filename
    6111711