DocumentCode
2760007
Title
Power - Reliability tradeoff in low power 4-PAM signaling in on-chip communication
Author
Forooshani, Arash Abtahi ; Rokhani, Fakhrul Zaman ; Samsudin, Khairulmizam ; Behzadipour, Hamid
Author_Institution
Dept. of CCSE, Univ. Putra Malaysia, Serdang, Malaysia
fYear
2011
fDate
19-20 July 2011
Firstpage
109
Lastpage
114
Abstract
The higher data rates at low power consumption have recently directed attentions towards on/off-chip multilevel signaling. However, its tighter noise margin cost leads to reliability concern. In this work, the reliability issue for multilevel signaling is highlighted using 4-PAM scheme. Three cost-effective architectures based on Hamming codes are synthesized in 45-nm technology to analyze the tradeoffs between reliability improvement and power consumption. Results showed that the 8-(7,4) configuration can enhance the 4-PAM signaling performance more than 3.3-dB at the Bit Error Rate of 10-6 while reducing power consumption up to 58% against binary for a 10-mm global on-chip interconnect. Furthermore, it is shown that higher levels of reliability are achievable at the cost of lower power savings. This paper provides guidelines to the designers for selecting between signaling schemes given the design characteristics and constraints.
Keywords
Hamming codes; error statistics; fault tolerance; integrated circuit interconnections; integrated circuit reliability; microprocessor chips; signalling; Hamming code; bit error rate; cost-effective architecture; low power consumption; low-power 4-PAM signaling; off-chip multilevel signaling; on-chip communication; on-chip interconnection; power consumption; power reliability tradeoff; power saving cost; reliability improvement; size 10 mm; size 45 nm; Bit error rate; Encoding; Forward error correction; Noise; Power demand; Reliability; Wires; Fault Tolerant Technique; Forward Error Correction; Low Power On-Chip Communication; Multilevel Signaling;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ASQED), 2011 3rd Asia Symposium on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4577-0145-0
Type
conf
DOI
10.1109/ASQED.2011.6111711
Filename
6111711
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